Nrog rau kev nce ntawm tib neeg txoj kev paub txog kev nyab xeeb, cov ntaub ntawv rwb thaiv tsev tau dav siv nyob rau hauv ntau lub sijhawm los ua cov nyhuv insulating. Thaum lub caij los nag, cov av noo yog siab, thiab kev tiv thaiv kev tiv thaiv kev ua haujlwm tseem ceeb dua. Vim tias cov dej nag hauv lub caij los nag loj heev, ntau chav faib khoom thiab chav faib khoom tau pib siv cov ntaub ntawv rwb thaiv tsev siab dua rau kev nyab xeeb, yog li qhov kev thov rau cov khoom tau nce ntau.
Cov ntawv rwb thaiv tsev yog tsim los ntawm GF (xov paj tshwj xeeb), UP (unsaturated resin), qis shrinkage additives, MD (filler) thiab ntau yam additives. Nws muaj cov khoom siv hluav taws xob rwb thaiv tsev, cov khoom siv kho tshuab, thermal stability, tshuaj tiv thaiv corrosion, thiab ntau yam kev siv. Nws yog tsuas yog siv hauv kev lag luam tsheb, tsheb ciav hlau, hluav taws xob kev lag luam thiab kev sib txuas lus engineering, chav dej, cov ntaub ntawv hauv pem teb, cov khoom siv hluav taws xob tawg tawg, kev sib txuas lus wireless thiab lwm yam.
Cov ntawv rwb thaiv tsev feem ntau yog siv hauv chav faib khoom thiab chaw faib khoom rau kev tso cov chaw faib khoom. Rwb thaiv tsev daim ntawv xa mus rau cov organic polymer tebchaw uas muaj ob los yog ntau tshaj epoxy pawg nyob rau hauv lub molecule. Tsuas yog qee qhov, lawv cov txheeb ze molecular hnyav tsis siab. Cov qauv molecular ntawm epoxy resin yog tus cwj pwm los ntawm kev muaj cov epoxy pawg hauv cov saw molecular. Cov pab pawg epoxy tuaj yeem nyob ntawm qhov kawg, nruab nrab lossis hauv lub nplhaib qauv ntawm cov saw hlau molecular. Vim hais tias ntawm cov active epoxy pawg nyob rau hauv lawv cov qauv molecular, lawv muaj peev xwm undergo cross-linking tshua nrog ntau hom curing agents los tsim insoluble, infusible polymers nrog ib tug peb-dimensional network qauv.
